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MULTIPOINT WIRELESS TEMPERATURE TRACING AND CONTROL SYSTEM

  

In this project we will monitor temperature at number of points. We will give electronics location no to each location. At every location we will  measure temperature using ADC and LM 35 sensor. ADC will give signal to microcontroller. So if we have to use separate microcontroller at each location to measure temperature and if temperature is above the Limited temperature then micontroller will send code and data via RF transmitter or, IR transmitter or other FM transmitter. On receiver end  we will receive data wirelessly and will give it micontroller. Micontroller will process that data and will command to robot to move in that particular direction where temperature changed. When Robot will reach near to point where temperature increased it will take action to decrease temperature  . after decreasing temperature our robot will come back to its pos.ition  IN normal temperature controller we get a output for  on and off purpose only but in this project we control the speed of the  fan automatically.  In brief firstly we convert the temperature into small voltage with the help of lm 35 sensor. LM 35 is temerature sensor  convert the temperature in to small voltage at very accurately. Output of the temperature sensor is further converted into digital signal with the help of the ADC. IN this project we use ADC0809 . ADC 0809 is a 8 bit ADC and convert the any analogue signal into digital signal in 100 microsecond. To control the ADC we required a clock pulse, and 4 different signal . All this signal is provided by the controller. IN this project we use ic 89s51 as a main controller. IC 89s51 sense the output from the ADC in hex code. This HEX code is further converted into binary code with the help of program code inside the controller. IN the output device we use LCD display . LCD display display the contents of the display with the  help of the ASCII code. ASCII CODE  is a special code for displaying the character in the LCD.  In the controller we convert the binary code in to ASCII codes with the help of the code conversion program. Temperature sensor by the lm 35 is  now display in the ASCII code on the LCD display.

In the controller. We take four different output from the controller. These different output display the different temperature zone step by step.

 

 

Fire sensor:

We will also use thermocouple to sense fire. Thermocouple is a fire sensitive transducer . in this we use temperature sensitive metal wires. When it sense fire the get connected and give signal to micontroller. Microcontroller take action according to it

 

 

 

 

 

COMPONENTS USED:

 

ADC           0809

OPAMP      OP07

TEMPERATURE SENSOR               LM 335

MICROCONTROLLER           89C51

LCD                                         2 BY 16

CRYSTAL                               3.58 MHz

 

 

RESISTOR

          10 K            11  Pc

          50 K            2 Pc   VARIABLE

          1 K              VARIABLE

          2.2K            1 Pc

          470 OHM    1Pc

         

 

CAPACITOR

          22 PF          2 Pc

          10 MFD       1 PC

 

PUSH TO ON SWITCH 2 PC.

 

7805 REGULATOR

STEP DOWN TRANSFORMER       9-0-9

DIODE        IN 4007( 4Pc)

 

RELAY 4

 

500 OHM VARIABLE RESISTOR OF FAN REGULATOR

 

 

 

 

 

APPLICATIONS:

 

BOILERS

 

STEEL INDUSTRY

 

REMOTE AREAS

 

 

ADVANTAGES

 

LOW COST

 

EASY TO FABRICATE

 

RELIABLE

 

FLEXIBLE

 

PROCREDURE TO MAKE PROJECT:-

1.     IDEA OF PROJECT

In this stage   student  select the topic of the project of the project. Itís the main stage of project work.its the area where talented students shows their innovative ideas.  Innovative students make project with a new idea then others. We selected this project because we want to do something in with our own hands. We use main electronics components uded in the industry. First of  all we selected the GSM based project. Then we drop idea because there was little bit practical electronics to learn and mobile companies already providing those facility.

2.     STUDY MATERIAL AND CIRCUIT DIAGRAM

In this section we collected the study material. We searches about our project on google.com,www.yahoo.com,www.msn.com and www.ludhianaprojects.com. But we find many circuits and theory materials for our project. We were not sure about the circuits. Because circuit available on the site were provided by students. So we can really on them. Then we saw www.ludhianaprojects.com a project help provider site. Its help us lot. They helped us lot in our project. We find the circuit of our project in that site.

3.     Trail TESTING OF MAIN CIRCUIT- Then we collect the components  of project. It was not a easy task. Because no shop in our area have all the components. Then after collection of components we test the circuit on bread board - step by step. Because we want to sure about the circuit. We checked it in different steps beacuuse it was a big project and  was not possible to check it in a single step.

4.     PCB DESIGNING - After Testing of circuite sure about the circuit.

First of all we designed the layout of PCB .

Then we made a screen .

After that we mark the layout on clad board with the help of paint and screen.

Then we  dip that painted PCB in Ferric chloride solution.

After that we drill holes in PCB.

Then we washed PCB with Isopropyl solution.

5.     COMPONENT MOUNTING- We kept the hole size from 0.8mm yo 1 mm for leads of components. Then we insert components according ton their pitches.

6.     SODERING- Afgter mounting components we solder the components ane by one. We kept the temperature of iron at 250 degree to 400 degree. Because above this temperature it can damage to component. We used general iron available in the market of siron company. Its temperature was nearly 350 degree acc to company specifications.  We used soldering wire of 22 gauge with flux inbuilt.

7.     FINAL TESTING- After that  we test the circuit step by step . and insert the ICs after testing the one portion of the circuit an then after other step by step. Its was tough work  we tested voltage across the compents with erepect to ground. And current in series.

8.     TROUBLSHOOTING- Then we tried to troubleshoot the errors in the project.

 

 

 

 

Steps to fabricate project

 

STEPS

TIME

RESPONSIBILTY

PROJECTS SELECTION

 

 

CIRCUIT AND THEORY ARRANGEMENT

 

 

CHECKING AVAILABILITY OF COMPONENTS

 

 

TESTING CIRCUIT

 

 

PCB DESIGN

 

 

COMPONENT INSERTION AND SOLDERING

 

 

TESTING

 

 

REWORK  OR TROOUBLE SHOOTING

 

 

 

 

 

  Bibliography:

www.ludhianaprojects.com/antifalling_collision robot.doc

www.mcu/projects.html